发明名称 |
METHOD FOR REDIRECTING VOID DIFFUSION AWAY FROM VIAS IN AN INTEGRATED CIRCUIT DESIGN |
摘要 |
A method for redirecting void diffusion away from vias in an integrated circuit design includes steps of forming an electrical conductor in a first electrically conductive layer of an integrated circuit design, forming a via between a distal end of the electrical conductor and a second electrically conductive layer of the integrated circuit design, and reducing tensile stress in the electrical conductor to divert void diffusion away from the via.
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申请公布号 |
US2008132065(A1) |
申请公布日期 |
2008.06.05 |
申请号 |
US20080018849 |
申请日期 |
2008.01.24 |
申请人 |
ALLMAN DERRYL D J;BHATT HEMANSHU D;MAY CHARLES E;BURKE PETER AUSTIN;KWAK BYUNG-SUNG;SUN SEY-SHING;PRICE DAVID T;PRITCHARD DAVID |
发明人 |
ALLMAN DERRYL D. J.;BHATT HEMANSHU D.;MAY CHARLES E.;BURKE PETER AUSTIN;KWAK BYUNG-SUNG;SUN SEY-SHING;PRICE DAVID T.;PRITCHARD DAVID |
分类号 |
H01L21/44 |
主分类号 |
H01L21/44 |
代理机构 |
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代理人 |
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