首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
Wohndachfenster-Einbauvorrichtung
摘要
申请公布号
DE50309694(D1)
申请公布日期
2008.06.05
申请号
DE20035009694
申请日期
2003.09.25
申请人
ROTO FRANK AG
发明人
HACKELBERG, JUERGEN;MEINIKHEIM, HEIKO
分类号
E04D13/03
主分类号
E04D13/03
代理机构
代理人
主权项
地址
您可能感兴趣的专利
Interface for light barrier device has communication device for optoelectronic data transfer activated by magnetically-operated switch
Determining positions of user equipment in radio communications systems involves measuring transition time of measurement signal between base station and user equipment
Scooters can be coupled next to each other or with one behind other and used on land or on water, with desired change of direction made synchronously by corresponding mechanical or electromechanical transmission
ELECTRONIC BILL PRESENTMENT AND PAYMENT SYSTEM AND METHOD
WAFER CARRIER WITH GROOVE FOR DECOUPLING RETAINER RING FROM WAFER
Digital signal sequence generator for audio analyzer reads out repeatedly next data block from ring buffer only when repeated read out of previous data block is interrupted
Electric mirror has visual display screen with greater than 30-inch diameter mounted on end and with digital camera preferably integrated into housing, uses computer technology for display
Verstelleinrichtung zur Drehverstellung zweier zentrisch gelagerter Bauteile, insbesondere für einen Sitz vorzugsweise eines Kraftfahrzeugs
OPERATION MODE DETECTION SWITCH OF MAGNETIC RECORDING AND REPRODUCING APPARATUS
THE METHOD OF OPERATION OF RELUCTANCE MOTOR
HEAT EXCHANGER
ENCRYPTION METHOD FOR DIGITAL DATA FILE
Microwave repeater system
Aqueous cleaning solution for removing contaminants from surface of integrated circuit substrate and cleaning method using thereof
The lighter attached pocket tool
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
Controller for use in motor operated valve and control method therefore
heat treatment method for wafer
Method of forming selective metal layer and method of forming capacitor and filling contact hole using the same
Cleaning and bonding wafers involves rotating wafers while moving nozzle over wafers and spraying cleaning liquid onto surfaces, drying and directly bonding wafers
