| 摘要 |
<p>Provided is a semiconductor device wherein stress is prevented from locally concentrating to an external connecting terminal on a post and thus damages of the external connecting terminal can be prevented. The semiconductor device is provided with a semiconductor chip; a sealing resin layer stacked on a surface of the semiconductor chip; and the post, which penetrates the sealing resin layer in a stacking direction of the semiconductor chip and the sealing resin layer, protrudes from the sealing resin layer, and has a circumference section of the protruding section in contact with a surface of the sealing resin layer by facing the surface in the stacking direction.</p> |
