发明名称 |
LED LIGHTING WITH INTEGRATED HEAT SINK AND PROCESS FOR MANUFACTURING SAME |
摘要 |
A method for manufacturing an LED lamp assembly includes anodizing at least a portion of a surface of an electrically and thermally conductive base, such as an aluminum or aluminum alloy base, so as to form an electrically insulating coating. The base may form a heat sink or be coupled to a heat sink. Circuit traces are formed on the anodized surface of the base, which include LED landings. LEDs are electrically and mechanically attached to the LED landing by a conductive metallic solder such that heat generated from the LED is transferred efficiently through the solder and circuit traces LED landings to the base and heat sink through a metal-to-metal contact pathway. |
申请公布号 |
EP1927274(A2) |
申请公布日期 |
2008.06.04 |
申请号 |
EP20060825044 |
申请日期 |
2006.09.20 |
申请人 |
ARTAK TER-HOVANISSIAN PATENT TRUST |
发明人 |
TER-HOVHANNISSIAN, ARTAK |
分类号 |
H05K3/00;B60Q1/06;B60Q1/26;F21K99/00;H01G5/12;H01G5/14;H01L29/18;H01L29/22;H01L33/00;H01R9/00;H05K3/02;H05K3/06;H05K3/10;H05K3/34;H05K7/14;H05K7/18 |
主分类号 |
H05K3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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