发明名称 ADHESIVE COMPOSITION AND ADHESIVE FILM
摘要 <p>An adhesive composition which is reduced in gas generation upon heating (has low hygroscopicity), has high alkali resistance, has heat resistance of 200°C or higher, and can be easily removed with a stripping liquid; and an adhesive film made with the adhesive composition. The adhesive composition is prepared using, at least as a major ingredient, an acrylic polymer produced from (a) styrene, (b) a (meth)acrylic ester monomer containing a cyclic skeleton, and (c) an alkyl (meth)acrylate monomer. The adhesive film has an adhesive composition layer formed from this adhesive composition.</p>
申请公布号 KR20080049127(A) 申请公布日期 2008.06.03
申请号 KR20087009505 申请日期 2008.04.21
申请人 TOKYO OHKA KOGYO CO., LTD. 发明人 MISUMI KOICHI;MIYAGI KEN;MIYANARI ATSUSHI;INAO YOSHIHIRO
分类号 C09J133/06;B24B37/30;C09J7/02;C09J133/08;H01L21/301;H01L21/304 主分类号 C09J133/06
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