SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE SAME

摘要

A semiconductor module and a manufacturing method thereof are provided to prevent a breakdown of an edge of a semiconductor package by positioning the edge of the semiconductor package in a recess of a printed circuit board. A semiconductor package(110) includes an external connection terminal(112). A printed circuit board(120) includes a recess and a terminal land. The external connection terminal is inserted into the recess. The recess has a width narrower than the width of the semiconductor package. The terminal land is formed on a bottom surface of the recess and is electrically connected to the external connection terminal. The printed circuit board includes a substrate body and an insulating layer pattern formed on the substrate body. The insulating layer pattern has the recess.