发明名称 METHOD FOR FORMING OF PERFORATIONS IN A SUBSTRATE
摘要 <p>THE INVENTION RELATES TO A METHOD FOR FORMING OF INDIVIDUAL PERFORATIONS (1) OF A PREDETERMINED POSITION IN A SUBSTRATE (2) EMBODIED AS A SCREEN PRINTING BY MEANS OF A LASER. FOR THIS PURPOSE, THE SUBSTRATE (2) IS POSITIONED BY MEANS OF A FIXING MEDIUM (3) EMBODIED AS A TENTER FRAME. ANY LOCAL DISPLACEMENT OF PERFORATIONS (1) DUE TO THE STATE OF TENSION OF THE SUBSTRATE (2) CHANGING DUE TO SUBSEQUENT PROCESSING STEP IS AVOIDED IN THAT INITIALLY THE COORDINATES OF A CENTRAL REFERENCE POINT (4) ARE DETERMINED. THE RESPECTIVE DISTANCE (A) OF THE PREDETERMINED POSITIONS OF THE PERFORATIONS (1) FROM THIS REFERENCE POINT (4) IS SUBASEQUENTLY DETERMINED, AND THE ORDER OF SEQUENCE (5) IS FORMED FROM THE SAME. THIS ORDER OF SEQUENCE (5) THEN FORMS THE BASIS FOR A PROCESSING PROGRAM (6), WITH WHICH THE PATH OF MOVEMENT OF THE LASER HEAD IS CONTROLLED, AND THE PERFORATIONS (1) ARE FORMED IN THE SUBSTRATE (2).FIG.1</p>
申请公布号 MY135614(A) 申请公布日期 2008.05.30
申请号 MY2005PI03436 申请日期 2005.07.26
申请人 LPKF LASER & ELECTRONICS AG 发明人 STEPHAN WENKE
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