| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a production method of a semiconductor device in which in the case of forming a pattern having a linear part by etching using a photoresist, the linearity of the linear part can be secured. <P>SOLUTION: In this method, for relaxing the heat contraction of a photoresist 2, corresponding to linear parts 2a, 2b of the photoresist 2, a plurality of opening parts 2c are arranged in parallel. Thus, the heat contraction of the photoresist 2 during the exposing, resolving or etching step of the photoresist 2 can be prevented and the linearity of the linear parts 3a, 3b during forming a trench 3 using the photoresist 2 as the mask can be secured. <P>COPYRIGHT: (C)2008,JPO&INPIT |
