| 摘要 |
PROBLEM TO BE SOLVED: To provide a mold cleaning method which enables the effective removal of a (meth)acrylic resin that adheres to a mold having a surface with fine unevennesses without damaging the mold. SOLUTION: The mold cleaning method, which cleans the mold having a (meth)acrylic resin stuck thereon, is characterized by irradiating UV having a wavelength of≤200 nm onto the mold and decomposing and removing the (meth)acrylic resin. The mold has recesses whose cross sections are rectangular, and preferably the width of the recesses is≥150 nm and the depth is≤700 nm. Alternatively, the mold is provided with inverted cone-shaped recesses and it is preferable that the opening diameter of the recesses is≥300 nm and the depth is≤450 nm. COPYRIGHT: (C)2008,JPO&INPIT
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