发明名称 HEAT TREATMENT APPARATUS OF MANUFACTURING OBJECT, HEAT TREATMENT METHOD, AND METHOD FOR MANUFACTURING PIEZOELECTRIC DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a heat treatment apparatus of a manufacturing object, a heat treatment method, and a method for manufacturing a piezoelectric device, which can prevent variation during manufacturing even if the manufacturing objects are arranged in a chamber in a height direction and can shorten manufacturing time. <P>SOLUTION: The heat treatment apparatus includes a chamber 40 which can house a plurality of manufacturing objects being arranged in a height direction, a gas supply means 76 to charge gas in the chamber 40, a radiation type heating means 60 to heat the manufacturing objects by radiant heat, a churning means 70 to churn the gas in the chamber 40 while the radiation type heating means 60 is working, and a vacuum generating means 74 to vacuumize the chamber 40 by discharging the gas. <P>COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008124204(A) 申请公布日期 2008.05.29
申请号 JP20060305594 申请日期 2006.11.10
申请人 EPSON TOYOCOM CORP 发明人 MURATA KENICHIRO;YAMADA SOICHIRO;IKEGAMI YASUMITSU
分类号 H01L23/02;H01L21/52;H01L41/09;H01L41/18;H01L41/22;H01L41/23;H01L41/313 主分类号 H01L23/02
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