| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an adhesive sheet which acts as a dicing tape in a dicing process and acts as an adhesive sheet which is excellent in connection reliability in a joining process between a semiconductor element and a supporting member. <P>SOLUTION: The adhesive sheet comprises a pressure-sensitive adhesive layer and a substrate layer, wherein the strength of adhesion between the pressure-sensitive adhesive layer and the substrate layer is controlled by means of the irradiation with radiation and the pressure-sensitive adhesive layer (A1) has 200 mN/cm or more of the strength of adhesion between the pressure-sensitive adhesive layer and the substrate layer before the irradiating and has at least one characteristic in the following characteristics: (B1) the amount of flow at 160°C before the irradiating is 100-10,000μm; and (B-2) the melt viscosity at 160°C before the irradiating is 50-100,000 Pa s. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
