IMPROVED ELECTROLESS COPPER COMPOSITION

摘要

PROBLEM TO BE SOLVED: To provide an electroless copper plating composition which is free from formaldehyde harmful as a reducing agent and is environmentally friendly, and also provides uniform copper deposits. SOLUTION: The electroless copper plating composition comprises: one or more sources of copper ions; one or more chelating agents chosen from hydantoin and hydantoin derivatives; and one or more reducing agents chosen from fructose and fructose esters. Also, disclosed is an electroless copper plating method for a printed circuit board including a plurality of through-holes using the copper electroless plating composition. COPYRIGHT: (C)2008,JPO&INPIT