发明名称 METHOD FOR MOLDING DIFFUSION BOARD OF DIRECT TYPE BACKLIGHT MODULE AND APPLICATION THEREOF
摘要 Disclosed is a method for molding a diffusion board of a direct type backlight module, including the steps of providing a board made of a material in which diffusion particles are mixed, passing the board through a roller set including an upper roller and a lower roller, the upper roller having a surface opposing the board and forming a micro-structure thereon, and heating and passing the board with the upper roller so as to transfer the micro-structure of the upper roller to a surface of the board and thus forming at least an optic micro-structure on the surface of the board so as to obtain a diffusion board. As such, when the diffusion board is applied to a backlight module, spreading and focusing of light can be effected without any optic film, so that the costs of the backlight module can be reduced.
申请公布号 US2008123347(A1) 申请公布日期 2008.05.29
申请号 US20060557505 申请日期 2006.11.08
申请人 MAI CHIEN-CHIN 发明人 MAI CHIEN-CHIN
分类号 F21V3/00;B29D11/00 主分类号 F21V3/00
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