发明名称 |
Semiconductor package with encapsulant delamination-reducing structure and method of making the package |
摘要 |
A semiconductor package and method of making the package uses at least one encapsulant delamination-reducing structure positioned on an upper major surface of a semiconductor chip to provide a structural interface between the semiconductor chip and an encapsulant formed over the semiconductor chip. |
申请公布号 |
US2008122122(A1) |
申请公布日期 |
2008.05.29 |
申请号 |
US20060594603 |
申请日期 |
2006.11.08 |
申请人 |
|
发明人 |
WONG WENG FEI;WONG FU MAUH |
分类号 |
H01L23/31;H01L21/71 |
主分类号 |
H01L23/31 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|