| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an aqueous dispersant for chemical-mechanical polishing capable of obtaining a highly accurate polished surface without changing the physical property of an insulating layer and without generating surface defects such as material peeling or scratches on the polished surface when performing chemical-mechanical polishing of the insulating layer, a chemical-mechanical polishing method, and a kit for preparing the aqueous dispersant for chemical-mechanical polishing. <P>SOLUTION: The aqueous dispersant for chemical-mechanical polishing (A) abrasive grains, (B) quinoline carboxylic acid and/or pyridine carboxylic acid, (C) organic acid other than (B), (D) oxidant, (E) nonionic surfactant having triple bond indicated by a formula (1) (in the formula (1), n and m are respectively independently an integer≥1 and satisfy n+m≤50), and (F) a dispersion medium. The abrasive grains (A) are colloidal silica whose average primary particle diameter is 5 to 55 nm and the degree of association is 1.5 to 4.0. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
