| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a light-emitting device with which the light-emitting device can be manufactured without reflectance reduction through a simple method without alloying metals on joint faces. <P>SOLUTION: A selective working layer 2 and a light-emitting device layer 8 are sequentially formed on a seed substrate 1. Then, a first metal layer 9 that becomes a reflection layer, is formed over all or in a part of the light-emitting device layer, and a second metal layer 10 having etching resistant characteristics is formed at least on a side surface of the first metal layer 9. Furthermore, the second metal layer 10 is bonded on a support substrate 11 and the seed substrate is removed from the selective working layer. In the present invention, the first metal layer is covered with the second metal layer with high corrosion resistance, alloying is obviated and high reflectance can be obtained. <P>COPYRIGHT: (C)2008,JPO&INPIT |
