发明名称 MANUFACTURING METHOD OF OPTICAL CIRCUIT BOARD WITH ADHESIVE LAYER, AND OPTICAL CIRCUIT BOARD WITH ADHESIVE LAYER
摘要 PROBLEM TO BE SOLVED: To provide a manufacturing method of an optical circuit board with an adhesive layer which has superior productivity, and the optical circuit board with the adhesive layer. SOLUTION: The manufacturing method of the optical circuit board with the adhesive layer includes a first stage of bonding a sheet type adhesive, having a pressure-sensitive adhesive layer and an adhesive layer formed in this order on a support base material, and the optical circuit board together, a second stage of dividing the optical circuit board into pieces, and a third stage of decreasing the contact force of the interface between the pressure-sensitive adhesive layer and support base material to peel the pressure-adhesive layer off along the interface. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008122908(A) 申请公布日期 2008.05.29
申请号 JP20070119530 申请日期 2007.04.27
申请人 HITACHI CHEM CO LTD 发明人 SHIBATA TOMOAKI;MASUDA HIROSHI;TAKAHASHI ATSUSHI
分类号 G02B6/13;G02B6/122 主分类号 G02B6/13
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