发明名称 INDUCTION HEATING BONDING APPARATUS
摘要 <p>The invention includes a rectifier 10, a switching part 20 to generate the high frequency current, a pulse with modulator 30 to generate driving signal for switching operation, a controller 40 to control the pulse with modulator 30, a coil unit 50 to generate magnetic field to bond the materials 3. The controller 40 firstly controls the pulse width modulator 30 to generate a driving signal with the first duty ratio to raise the temperature to a target temperature, and then a reduced second duty ratio to keep the temperature of the electro-conductive member 2 at the target temperature.</p>
申请公布号 WO2008062993(A1) 申请公布日期 2008.05.29
申请号 WO2007KR05842 申请日期 2007.11.21
申请人 SMART CORPORATION CO., LTD.;CHOI, KI SEOK 发明人 CHOI, KI SEOK
分类号 H05B6/06 主分类号 H05B6/06
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