MEMS PACKAGE AND PACKAGE METHOD THEREOF

摘要

A MEMS(Micro Electro-Mechanical System) package and a method thereof are provided to improve yield by bonding the MEMS device and a driving electronic device directly. A MEMS package comprises an MEMS device(100) and a driving electronic device(200). The MEMS device is made up of an MEMS structure(114) formed on a substrate; a first pad electrode(116) for driving the MEMS structure; a first sealing unit(118) formed at the edge portion of the substrate; and a connection unit(120) formed on the first pad electrode and the first sealing unit. The driving electronic device comprises a second pad electrode(206) and a second sealing unit(208) corresponding to the first pad electrode and the first sealing unit respectively. And the driving electronic device is bonded with the MEMS device.