| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a light-emitting device which improves the reliability with light-emitting element configuration suited for glass encapsulation. <P>SOLUTION: The light-emitting device comprises an LED element 2 having an electrode formation section 2a where electrodes 25 and 27 are formed, an element mounting substrate 3 for mounting the LED element 2, and a glass encapsulation section 4 which encapsulates the LED element 2 formed on the element mounting substrate 3 and has a glass transition point of 340°C or higher. No passivation film is provided on the electrode formation section 2a of the LED element 2 to bring the electrode 27 into direct contact with a hollow section 5. <P>COPYRIGHT: (C)2008,JPO&INPIT |
