Multilayer printed wiring board and method for producing the same

摘要

In a process for manufacturing a multilayer printed circuit board which comprises constructing a conductor circuit (104), roughening the conductor circuit (104) to provide a roughened surface (111), forming an interlayer resin insulating layer (102) over the roughened surface (111) of the conductor circuit (104) and forming openings (106) for via holes in a repeated sequence to construct conductor circuits comprised a plurality of layers isolated by interlayer resin insulating layers, an oxidation treatment is carried out after forming the roughened surface (111) on the conductor circuit (104) to provide an oxide film on the entire roughened surface (111), and thereafter the interlayer resin insulating layer (102) is constructed.