| 摘要 |
A flexible layer for a carrier head is provided to perform a CMP process on a substrate by making a junction part between a main part and an outer annular part of a flexible layer have an annular recess on a peripheral edge hinge and a hinge along the outer wall of the outer annular part. A flexible layer(300) includes a main part and an outer annular part. The main part has a lower surface for supplying a substrate mount surface. The outer annular part is extended from the outer edge of the main part. A junction part between the main part and the outer annular part includes an annular recess on a peripheral edge hinge and a hinge along the outer wall of the outer annular part. The peripheral edge hinge has compliance, including rounded inner and outer surfaces. The outer annular part can include an annular recess along its outer wall and an annular step inwardly protruded along its inner wall. The annular recess allows bending of the annular part, and the annular step has non-horizontal upper and lower surfaces. |
