发明名称 |
Heating apparatus and method for semiconductor devices |
摘要 |
A heating apparatus and method for heating a semiconductor device during bonding of electrical contacts onto the device is provided, which includes a heating plate that is provided for heating the semiconductor device and a layer of compliant material extending over at least a portion of the heating plate for mounting the semiconductor device. A holding mechanism secures the semiconductor device on the layer of compliant material during bonding of electrical contacts onto the semiconductor device while it is being heated by the heating plate.
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申请公布号 |
US7378616(B2) |
申请公布日期 |
2008.05.27 |
申请号 |
US20050144330 |
申请日期 |
2005.06.03 |
申请人 |
ASM TECHNOLOGY SINGAPORE PTE. LTD. |
发明人 |
CHAN TIN KWAN BOBBY;LUM CHOONG KEAD LESLIE |
分类号 |
F27D11/00;A21B1/00;H01L21/00;H01L23/48 |
主分类号 |
F27D11/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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