| 摘要 |
A process for cutting at least one indicia adapted to be applied to an object includes providing a cutting device capable of cutting multiple depths; providing a material having an applicable layer and a supporting carrier layer; positioning the material relative to the cutting device; employing the cutting device to make at least one indicia cut through only the applicable layer of an outline of at least one indicia and at least one cavity cut through both the applicable layer and the carrier layer within the outline of the indicia to form a cavity surrounded by the indicia; and subsequent to the indicia cut, employing the cutting device to make a border cut through both the applicable layer and the carrier layer beyond the indicia to form an outline of a polygonal shape around the indicia. An indicia material made by the process is also disclosed.
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