发明名称 CARD WITH BUILT-IN MODULE
摘要 <P>PROBLEM TO BE SOLVED: To provide an easy-to-manufacture card with built-in module that has a display element as an electronic part and exposes a display part of the display element to the outside. <P>SOLUTION: The card 10 with built-in module comprises a module 13 having the display element 12, an adhesive layer 14 for covering the module 13, and a pair of first and second substrates 15 and 16 for sandwiching the module 13 via the adhesive layer 14. The display part 12a of the display element 12 is fixed to the first substrate 15 via a transparent adhesive layer 17. The first substrate 15 is transparent and the adhesive layer 14 is colored. <P>COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008117273(A) 申请公布日期 2008.05.22
申请号 JP20060301520 申请日期 2006.11.07
申请人 TOPPAN FORMS CO LTD 发明人 SAKURAI TAKAHIRO;ITO YUICHI
分类号 G06K19/07;B42D15/10;G06K19/077 主分类号 G06K19/07
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