Ball grid array package assembly with integrated voltage regulator

摘要

An integrated voltage regulator may be provided on the bottom of a ball grid array processor package. This may be done despite the fact that conventionally integrated voltage regulator chips are too thick to fit in the area normally available between the motherboard and the ball grid array package because that area is defined by solder balls of a necessarily limited height which is conventionally believed to be too small to accommodate the integrated voltage regulator.