| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To reduce time and cost relating to the testing process by improving the uniformity and the precision of the burn-in test conditions and widening the testing items executable during a burn-in test. <P>SOLUTION: A apparatus for testing burn-in comprises a DUT socket directly controlling temperature for each semiconductor device, without the use of a thermostatic chamber; a testing control device comprising a temperature control means for controlling the temperatures, an electrical condition imparting means for imparting electrical conditions and a discrimination information imparting means for imparting discrimination information for the test subject semiconductor device loaded on the DUT socket; and a host control device, capable of communicating with the testing control device, having a control means for comprehensively controlling the burn-in test as a whole for the test subject semiconductor device loaded on the DUT socket. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
