发明名称 |
WIRING BOARD, METHOD FOR MANUFACTURING THE SAME, AND ELECTRONIC DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a wiring board by which a reliable wiring board can be manufactured while the pressure acting on a drive circuit element to be transferred is made uniform, and to provide an electronic device having the wiring board. SOLUTION: The wiring board comprises: a pixel region 101 formed on a substrate and having a plurality of pixels; drive circuit elements 15 arranged on a part of the periphery of the pixel region 101 on the substrate to drive each pixel; and dummy elements 15D arranged on a part of the region other than the region wherein the drive circuit element 15 is arranged on the periphery of the pixel region 101 on the substrate. COPYRIGHT: (C)2008,JPO&INPIT
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申请公布号 |
JP2008116652(A) |
申请公布日期 |
2008.05.22 |
申请号 |
JP20060299226 |
申请日期 |
2006.11.02 |
申请人 |
SEIKO EPSON CORP |
发明人 |
HARA HISAKI |
分类号 |
G09F9/00;G02F1/167;G02F1/17;H01L51/50;H05B33/02 |
主分类号 |
G09F9/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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