| 摘要 |
PROBLEM TO BE SOLVED: To provide a liquid processing apparatus capable of processing liquid remaining on the back of a substrate or the back and edge portions of the substrate while preventing liquid from reaching the surface of the substrate without use of a complicated mechanism. SOLUTION: The liquid processing apparatus 100 comprises: a wafer holding portion 2 that horizontally holds a wafer W and that is rotatable together with the wafer W; a rotation mechanism 3 for rotating the wafer holding portion 2 together with the wafer W; a liquid supply nozzle 6 for supplying liquid to the back of the wafer W that is held by the wafer holding portion 2; a drainage cup 51 provided to surround the wafer W held by the wafer holding portion 2; and a partition member 35 provided in a ring shape outside the wafer held by the wafer holding portion 2 to prevent the liquid supplied from the liquid supply nozzle 6 for supplying liquid to the backside of the wafer from flowing around to the surface of the wafer W and to guide liquid shaken from the wafer W to the drainage cup 51. COPYRIGHT: (C)2008,JPO&INPIT
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