发明名称 LAMINATED BODY FOR FLEXIBLE PRINTED WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a laminated body for a flexible printed wiring board that comprises a conductor layer formed on a resin film, has an excellent etching characteristic and excellent adhesion between the resin film and the conductor layer, which are particularly held even after a durability test, and thereby has superior reliability. SOLUTION: In the laminated body for a flexible printed wiring board, a copper alloy layer that contains 0.1 to 10.0 atom% of Mg and/or Si is formed on a resin film. The copper alloy layer containing 0.1 to 10.0 atom% of Mg and/or Si is formed on the resin film, and a copper sputter layer and/or a copper plating layer are/is formed on the copper alloy layer. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008117967(A) 申请公布日期 2008.05.22
申请号 JP20060300560 申请日期 2006.11.06
申请人 KOBE STEEL LTD 发明人 HIRANO TAKAYUKI;OKUNO HIROYUKI;MIZUNO MASAO;KAWANAKA TAKEO
分类号 H05K1/09;B32B15/08;B32B15/20;H05K1/03;H05K3/00 主分类号 H05K1/09
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