发明名称 |
METHOD OF PLASMA TREATMENT AND TREATMENT APPARATUS |
摘要 |
<P>PROBLEM TO BE SOLVED: To prevent instability of plasma at the time of switching of plasma treatment conditions when step switching is performed while plasma discharge is continued in a plasma treatment method. <P>SOLUTION: The method of plasma treatment uses a plasma treatment apparatus that is provided with a plasma treatment chamber, a high frequency power supply for generating plasma and an automatic matching machine which automatically reduces reflected power of the high frequency power supply for generating plasma. In this case, plasma treatment conditions after switching of treatment conditions are previously determined (step 1). Test discharge is performed under the treatment conditions after switching and the position of matching elements is recorded at the time of reduction in reflected wave by the automatic matching machine (step 2). When the plasma treatment conditions are switched, the automatic matching machine is moved to the position of the matching elements which is previously recorded (step 3). <P>COPYRIGHT: (C)2008,JPO&INPIT |
申请公布号 |
JP2008118017(A) |
申请公布日期 |
2008.05.22 |
申请号 |
JP20060301397 |
申请日期 |
2006.11.07 |
申请人 |
HITACHI HIGH-TECHNOLOGIES CORP |
发明人 |
TAMURA HITOSHI;TANAKA MOTOHIRO |
分类号 |
H01L21/3065;C23C16/505;H01L21/205;H05H1/46 |
主分类号 |
H01L21/3065 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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