发明名称 LASER MACHINING APPARATUS AND LASER MACHINING METHOD
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a laser machining method for performing grooving/trimming work in same line widths on a plurality of portions of a plurality of workpieces or one workpiece, using a plurality of laser machines. <P>SOLUTION: The laser machining method is used for conducting a plurality of laser machinings using a plurality of laser machines. The relations between predetermined laser irradiation conditions of a plurality of laser machines 6 and machining conditions of workpieces 11 are previously measured and the measured data are stored. The workpiece is machined based on the measured data of the first machine among the plurality of laser machines. Image recognition of the machining condition of the machined workpiece is carried out, the shape after the machining is measured, and the measured data are compared with the shape data of important parts of the workpiece so as to determine the laser irradiation conditions that agree with target specifications. The optimum irradiation conditions of each of the other laser machines that conform to the target specifications are determined out of the laser irradiation conditions of the other laser machines, which are stored according to the irradiation conditions. Laser machining is conducted under the optimum irradiation conditions. <P>COPYRIGHT: (C)2008,JPO&INPIT</p>
申请公布号 JP2008114257(A) 申请公布日期 2008.05.22
申请号 JP20060299919 申请日期 2006.11.06
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 SHIGEKAWA YASUSHI;SHIMADA JUN;OMIZU YOSHIHARU
分类号 B23K26/00;B23K26/03 主分类号 B23K26/00
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