| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a chip-bonding light-emitting diode which includes a permanently-installed substrate partially overlapped on a luminescent region, and has higher efficiency, and to provided its manufacturing method. <P>SOLUTION: The light-emitting diode 500 includes the permanently-installed substrate 530 having chip holding space formed on a surface of the substrate, a metal layer, a chip, a filler structure 542 which is filled up between the chip holding space and the chip, and a first electrode 508 formed on a surface of the chip. The metal layer comprises an insulating layer 540, a first region 528 and a second region 529 which are formed in order on the permanently-installed substrate 530 and a surface of the chip holding space, wherein the first and the second regions do not come into contact each other. The chip is mounted by a chip-bonding technique so that it may not come into contact with the second region 529, though it is joined to the first region 528 of the metal layer at a bottom of the chip holding space. The chip includes the luminescent region 510, and electrical connection is attained between the first region 528 and the second region 529 of the metal layer, and the luminescent region 510. <P>COPYRIGHT: (C)2008,JPO&INPIT |
