| 摘要 |
<p>The invention is directed to a method for polishing a cutting edge on a cutting instrument, comprising contacting a cutting edge of a cutting instrument with a polishing pad and a chemical-mechanical polishing composition comprising particles of an abrasive, and a liquid carrier, wherein the abrasive is suspended in the liquid carrier, and abrading at least a portion of the cutting edge to polish the cutting edge. The invention further provides a cutting instrument having a highly uniform edge.</p> |
