SUBSTRATE MEASURING METHOD, PROGRAM, COMPUTER-READABLE RECORDING MEDIUM RECORDED WITH PROGRAM, AND SUBSTRATE TREATMENT SYSTEM

摘要

PROBLEM TO BE SOLVED: To measure a product wafer without deteriorating the throughput of the product wafer. SOLUTION: In a coating/developing treatment system, wafers W in a plurality of lots L1to L4are successively treated, and a part of the wafers W that have been subjected to the treatment are selected for line width measurement. The line width measurement is performed for each of the lots L1to L4. The line width measurement of each of the lots L1to L4at the front and the rear is performed in such a manner that the last line width measurement of the previous lot has been finished at the time of the completion of the wafer treatment S1 of the wafer for performing the first line width measurement S2 of the succeeding lot of the lots that are successive from the front to the rear. For example, the line width measurement of the lots L1and L2at the front and the rear is performed in such a manner that the last line width measurement (the line width measurement of the wafers W1-6) of the preceeding lot L1has been finished at the time of the completion of the wafer treatment S1 of the wafers W2-1for performing the first line width measurement S2 of the subsequent lot L2. COPYRIGHT: (C)2008,JPO&INPIT