| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a power conversion device reduced in size by enhancing cooling efficiency and ensuring the regularity of internal wiring. <P>SOLUTION: First and second bases 11, 12 constructing a cooling passage forming body are disposed in the middle stage of the power conversion device, and semiconductor modules 20, 30 and a capacitor 50 are disposed on both sides of the cooling passage forming body. The cooling efficiency is thereby enhanced. Through holes 1112, 1122 are formed in the first and second bases 11, 12, and direct-current and alternating-current circuits are wired through the through holes 1112, 1122. Reduction in the size of the power conversion device is thereby achieved. <P>COPYRIGHT: (C)2008,JPO&INPIT |
