发明名称 DAYLIGHTING HEAT INSULATING MATERIAL
摘要 PROBLEM TO BE SOLVED: To provide a daylighting heat insulating material and a daylighting heat insulating plate having an excellent heat insulating property, a high transparency and lightweight while having less possibility of being cracked by heat. SOLUTION: The daylighting heat insulating material has a structure wherein a plurality of base films 1a, 1b, 1c are arranged facing to each other with a gas layer of a thickness of 100μm to 3 mm interposed therebetween while having a visible light transmissivity of 20% or more. At least one of the gas layers 2 is filled with low heat conductive gas having a thermal conductivity lower than that of air and is a low thermal conductive gas layer whose peripheral part is sealed. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008115682(A) 申请公布日期 2008.05.22
申请号 JP20070094724 申请日期 2007.03.30
申请人 SEKISUI CHEM CO LTD 发明人 MURAOKA HITOMI;NAKADA YASUSHI;ISHII MASAHIRO
分类号 E04B1/80 主分类号 E04B1/80
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