| 摘要 |
An apparatus for laser cutting having two laser sources and the method thereof are provided for the assembly substrate. An Yttrium Aluminum Garnet (YAG) laser is used to execute the cutting-off process for the positions without the terminals and the outer-edge positions of the terminals of the assembly substrate, and an Infra-Red (IR) laser is used to execute the cutting process for the inner-edge positions of the terminals of the assembly substrate. The YAG laser and the IR laser can be operated at different time or at the same time.
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