| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a component mounting head for so holding components as to mount them on a circuit forming body, and a manufacturing method thereof wherein while the number of component holding members installed by the component mounting head is increased, the number of the component holding members installed in the unit area of the component mounting head is so increased as to further improve the component mounting efficiency of the component mounting head. <P>SOLUTION: In each of first and second sub-heads provided in the component mounting head, there are provided a plurality of component holding members disposed in a rotatable way around the rotation center of each sub-head. Thereby, in each sub-head, each component holding member can so rotate around the rotation center of each sub-head as to be able to dispose each component holding member in an arbitrary position present on the circumference whereon each component holding member moves in a rotational way. <P>COPYRIGHT: (C)2003,JPO |
