发明名称 |
Bleifreies Halbleitergehäuse |
摘要 |
A package substrate includes die solder pads and pin solder fillets. The pin solder fillets might comprise between approximately 90 wt % to approximately 99 wt % tin and approximately 10 wt % to 1 wt % antimony. The die solder pads might comprise between approximately 4 wt % to approximately 8 wt % bismuth, approximately 2 wt % to approximately 4 wt % silver, approximately 0 wt % to approximately 0.7 wt % copper, and approximately 87 wt % to approximately 92 wt % tin. The die solder pads might comprise between approximately 7 wt % to approximately 20 wt % indium, between approximately 2 wt % to approximately 4.5 wt % silver, between approximately 0 wt % to approximately 0.7 wt % copper, between approximately 0 wt % to approximately 0.5 wt % antimony, and between approximately 74.3 wt % to approximately 90 wt % tin. |
申请公布号 |
DE112006001732(T5) |
申请公布日期 |
2008.05.21 |
申请号 |
DE20061101732T |
申请日期 |
2006.04.19 |
申请人 |
ADVANCED MICRO DEVICES INC. |
发明人 |
MASTER, RAJ N.;ANNAD, SRINIVASAN ASHOK;PARTHASARATHY, SRINIVASAN;MUI, YEW CHEONG |
分类号 |
H01L21/60;B23K35/26;C22C13/00;H01L23/498 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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