发明名称 Lithographic processing method and device manufactured thereby
摘要 A lithographic double exposure processing method for providing to a device layer a pattern comprises the steps of expanding each feature of a first mask pattern and second mask pattern with a preselected dilatation distance before the first and second exposure steps, resist-processing the exposed radiation sensitive layer of a substrate to provide resist-processed features corresponding to said pattern whereby each resist-processed feature is expanded with respect to its nominal size, and shrinking said resist-processed features over a preselected shrinking distance by applying supplementary resist-processing to said resist-processed features.
申请公布号 US7374869(B2) 申请公布日期 2008.05.20
申请号 US20040830418 申请日期 2004.04.23
申请人 ASML NETHERLANDS B.V. 发明人 KOHLER CARSTEN ANDREAS;VAN SCHOOT JAN BERNARD PLECHELMUS
分类号 G03F7/20;H01L21/027;G03F1/00;G03F1/14;G03F7/26;G03F7/40 主分类号 G03F7/20
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