发明名称 |
Chip package structure |
摘要 |
A chip package structure comprising a substrate, a chip, a plurality of bumps, some buffer material and some encapsulation is provided. The substrate has a first surface and a corresponding second surface. The chip has an active surface and a back surface. The bumps are disposed between the active surface of the chip and the first surface of the substrate. The buffer material is disposed on the back surface of the chip. The encapsulation is disposed over the first surface of the substrate to enclose the chip and the buffer material.
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申请公布号 |
US7375435(B2) |
申请公布日期 |
2008.05.20 |
申请号 |
US20050906536 |
申请日期 |
2005.02.24 |
申请人 |
ADVANCED SEMICONDUCTOR ENGINEERING, INC. |
发明人 |
WANG MENG-JEN;CHUNG CHIH-MING |
分类号 |
H01L23/48;H01L21/56;H01L23/16;H01L23/28;H01L23/31;H01L23/52;H01L25/065;H01L29/40 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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