| 摘要 |
A soldering apparatus and a method of mounting a flip chip on an FPCB(Flexible Printed Circuit Board) by using the same are provided to reduce the time required for soldering between the FPCB and flip chip and ensure consistent welding performance through constant heat supply. A soldering apparatus(100) for soldering a plurality of pads(3) patterned on an FPCB(Flexible Printed Circuit Board)(2) and a plurality of solder balls(30) formed on a flip chip(22) arranged the same as the pads, comprises a flip chip fixing plate(20), a multi-fiber array member(10), a guide plate(40), and a spacer(50). The flip chip fixing plate comprises a fixing member(21) configured to fix the flip chip. The multi-fiber array member comprises a plurality of single fibers(11) connected to a laser source(1) and whose end is changed to the same number as the solder balls. The guide plate guides each end of the single fibers to be spaced away from each other and fixed, comprising a board allowing each end of the single fibers to be located on the same position, and a fastener for partially or fully fixing the single fibers. The flip chip can be mounted in one-step process by simultaneously irradiating laser beam(L) to the solder balls through the FPCB. The spacer is installed between the FPCB and the guide plate.
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