| 摘要 |
The preferred embodiment the invention proposes pertains to a Telecommunication connector PCB layout, which is primarily comprised of the components of a fiberglass board or other condensed board material, copper foil, position hole, through hole. The invention utilizes the inner layer board for main circuit layout that allows the response circuit gap to instantly achieve an optimal balancing power condensing effect at the nearest distance, and the circuit will not be hindered by the outer layer's pressure resistance issue or the circuit's multiple copper buildups, and is able to derive a maximum compensation to the response yield at where near the plug to be able to better achieve stabilizing the functions of category-six communications protocols.
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