发明名称 |
CHEMICAL MECHANICAL POLISHING SLURRY COMPOSITIONS, METHODS OF PREPARING THE SAME AND METHODS OF USING THE SAME |
摘要 |
<p>Provided herein are chemical mechanical polishing (CMP) slurries and methods for producing the same. Embodiments of the invention include CMP slurries that include (a) a metal oxide; (b) a pH-adjusting agent; (c) a fluorinated surfactant; and (d) a quaternary ammonium surfactant. In some embodiments, the fluorinated surfactant is a non-ionic perfluoroalkyl sulfonyl compound. Also provided herein are methods of polishing a polycrystalline silicon surface, including providing a slurry composition according to an embodiment of the invention to a polycrystalline silicon surface and performing a CMP process to polish the polycrystalline silicon surface.</p> |
申请公布号 |
WO2008056847(A1) |
申请公布日期 |
2008.05.15 |
申请号 |
WO2006KR05109 |
申请日期 |
2006.11.29 |
申请人 |
CHEIL INDUSTRIES INC.;CHOUNG, JAE HOON;LEE, IN KYUNG |
发明人 |
CHOUNG, JAE HOON;LEE, IN KYUNG |
分类号 |
C09K3/14 |
主分类号 |
C09K3/14 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|