| 摘要 |
<p>The present invention relates to the improvement of metal bonding strength in polypropylene films through the addition of ethylene in a mini-random ethylene-propylene copolymer in an amount of no more than about 1 weight percent, more preferably no more than about 0.7 weight percent, and most preferably between about 0.3 weight percent and about 0.5 weight percent, or even amounts between about 0.05 weight percent and about 0.2 weight percent. The invention allows the improvement of metal bond strength in metallizable films. The invention encompasses both the resulting films with enhanced metal bond strength and the process for producing such films. In the preferred embodiment, the proposed mini-random copolymer is formed into a film layer used in place of a propylene homopolymer layer, providing improved bonding properties over a simple polypropylene homopolymer, while maintaining at acceptable levels the physical and optical characteristics of a film layer made from a propylene homopolymer, such as stiffness.</p> |
