发明名称 |
Halbleitervorrichtung mit gutem thermischem Verhalten |
摘要 |
The chip carrier island (3) is fixed to small diagonal supports (12) and has a large central opening (13) extending beyond the edge of the chip on two sides. In the depicted embodiment the opening is circular with dia. about equal to the length of a side of the chip, which is not in contact with the bar region (15) of the island. The area around the opening allows thermal expansion, assists removal of heat and reduces thermo-mechanical deformation. |
申请公布号 |
DE59611466(D1) |
申请公布日期 |
2008.05.15 |
申请号 |
DE1996511466 |
申请日期 |
1996.02.12 |
申请人 |
INFINEON TECHNOLOGIES AG |
发明人 |
PAPE, HEINZ DIPL.-PHYS.;HUBRICH, FRANK DIPL.-ING. |
分类号 |
H01L23/495 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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