发明名称 TEMPERATURE CONTROL SYSTEM FOR MOLD AND INJECTION MOLDING METHOD USING THE SAME
摘要 A temperature control system for a mold includes a circulation pipe provided in the mold, a heating water circulation section to provide heating water to the circulation pipe to pre-heat the mold, a cooling water circulation section to provide cooling water to the circulation pipe to cool the mold, and a compressed air circulation section to provide compressed air to the circulation pipe to eject remaining heating water or cooling water within the circulation pipe. The compressed air circulation section is adapted to supply the compressed air to the circulation pipe to eject remaining fluid within the circulation pipe before heating water or cooling water is provided to the circulation pipe.
申请公布号 US2008111280(A1) 申请公布日期 2008.05.15
申请号 US20070939181 申请日期 2007.11.13
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 CHOE ICK-SUNG;KIM YOUNG-KI;KANG SHIN-CHUL;CHIN WOO-SEOK;HWANG CHANG-YOUN
分类号 B29C45/17;B29C33/02 主分类号 B29C45/17
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