发明名称 |
Light emitting diode assembly and method of fabrication |
摘要 |
An LED assembly comprises an LED and a lens disposed adjacent to a light emitting surface of the LED. The area of cross-section of the lens projected onto the light emitting surface of the LED is substantially equal to or less than the area of the LED's light emitting surface. The light emitting device can comprise an array of LEDs and an array of lenses, in which at least one lens is associated with each member of the LED array and wherein the area of a cross-section of each lens projected onto the light emitting surface of its associated LED is substantially equal to or less than the area of the LED's light emitting surface.
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申请公布号 |
US2008111141(A1) |
申请公布日期 |
2008.05.15 |
申请号 |
US20070800977 |
申请日期 |
2007.05.07 |
申请人 |
INTEMATIX CORPORATION |
发明人 |
LI YI-QUN;DONG YI;SHAN WEI |
分类号 |
H01L21/00;H01L33/50;H01L33/54 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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