CIRCUIT BOARD UNIT, AND METHOD FOR PRODUCTION THEREOF

摘要

PROBLEM TO BE SOLVED: To provide a circuit board unit for removing the heat dissipated from SMDs in power electronic applications, and to provide a method for production thereof. SOLUTION: The circuit board unit comprises a circuit board topmost laminate 8 with conductive tracks 10 on the upper side for mounting surface-mountable devices SMDs 12, 14. The circuit board topmost laminate 8 features a thickness dimensioned such that the anticipated heat dissipated by the SMDs 12 is transported from the upper side to the underside of the circuit board topmost laminate 8 to good effect. The circuit board unit further comprises an electrically insulating laminate 9 arranged under the circuit board topmost laminate 8, inserts 15 made of a material with good heat conductivity and electrical insulation embedded in the electrically insulating laminate 9 at sides below SMDs 12 with high heat dissipation, and a cooling plate 16 arranged below the electrically insulating laminate 9 and the inserts 15. COPYRIGHT: (C)2008,JPO&INPIT